Chao-Kuang Chen 1 and Chih-Min Yao1
1Computational Science Division National Center for High-Performance Computing Science-based Industrial Park Hsinchu, Taiwan 300, R.O.C.
Received:
January 15, 2004
Accepted:
March 3, 2004
Publication Date:
June 1, 2004
Download Citation:
||https://doi.org/10.6180/jase.2004.7.2.10
ABSTRACT
In this study a micrometer level component actuated via the thermal loading that induces forward and backward buckling phenomenon is tested via the finite element analysis (FEA). A branch of comparison is interpreted through the analytical closed forms. The characteristics embedded in the analytical closed forms could reflect on the finite element model for the micro-strip actuator. It’s a start for the advanced investigation for practice applications.
Keywords:
Actuator, Thermal, Buckle
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