Journal of Applied Science and Engineering

Published by Tamkang University Press

1.30

Impact Factor

2.10

CiteScore

Wei-Chieh Yu1 and Shih-Hsu Huang This email address is being protected from spambots. You need JavaScript enabled to view it.1

1Department of Electronic Engineering, Chung Yuan Christian University, Chung Li, Taiwan 320, R.O.C.


 

Received: September 1, 2006
Accepted: August 2, 2007
Publication Date: March 1, 2008

Download Citation: ||https://doi.org/10.6180/jase.2008.11.1.05  


ABSTRACT


As the process shrinks into the deep sub-micron technology, the design complexity continues to increase. Therefore, the heat dissipation in a modern VLSI chip is skyrocketing. In this paper, we study the functional unit binding for heat dissipation. It is well known that, if there is more inactive time interval between two consecutive operations executing in the same functional unit, the more heat reduction can be achieved. Therefore, given a scheduled data flow graph (DFG) and the functional units, our objective is to maximize the summation of inactive time intervals. An integer linear programming (ILP) approach is proposed to formally formulate this problem. Benchmark data consistently show our approach achieves good results within an acceptable run time.


Keywords: Electronic Design Automation, Computer Aided Design, High Level Synthesis, Integer Linear Programming, Resource Binding


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