{"id":10968,"date":"2026-09-05T00:03:55","date_gmt":"2026-09-04T16:03:55","guid":{"rendered":"\/jase\/?post_type=tkuisotope&p=10968"},"modified":"2026-09-14T17:09:42","modified_gmt":"2026-09-14T09:09:42","slug":"multiple-layer-heat-dissipation-module-for-led-streetlamps","status":"publish","type":"tkuisotope","link":"\/jase\/?tkuisotope=multiple-layer-heat-dissipation-module-for-led-streetlamps","title":{"rendered":"Multiple-Layer Heat Dissipation Module for LED Streetlamps"},"content":{"rendered":"\n
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<\/i> 2012<\/a><\/p>\n<\/div>\n\n\n\n

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<\/i> Volume 15, Issue 2<\/a><\/p>\n<\/div>\n\n\n\n

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Shung-Wen Kang<\/i><\/a>, Kun-Cheng Chien, Wei-Chung Lin<\/p>\n\n\n\n

Department of Mechanical and Electro-Mechanical Engineering, Tamkang University, Tamsui, Taiwan 251, R.O.C.<\/p>\n<\/div>\n\n\n\n

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Received:\u00a0February 20, 2012
Accepted:\u00a0June 4, 2012
Publication Date:\u00a0June 4, 2012<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Schematicof LEDstreet lampwith heat dissipation module.<\/p>\n<\/div>\n<\/div>\n\n\n\n

<\/i> Copyright <\/strong>The Author(s). This is an open access article distributed under the terms of the Creative Commons Attribution License (CC BY 4.0)<\/a>, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are cited.<\/p>\n\n\n\n

Download Citation:  BibTeX <\/a>| http:\/\/dx.doi.org\/10.6180\/jase.2012.15.2.01<\/a>  <\/p>\n\n\n\n

Download PDF<\/a><\/p>\n\n\n\n

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High-powered light-emitting diodes (LED) have rapidly developed in recent years from applications in indication devices to wider uses in illumination devices. This study proposed an innovative heat dissipation module for an LED street lamp using a number of substrates positioned in multiple-layer formation. Multi-chip LED arrays were mounted on each substrate. Heat generated by the LEDs was dissipated through a heat dissipation plate formed by the substrates, which connected to heat pipes and a heat sink. This study used several simulation models to determine the natural convection properties of the proposed module. Based on the simulations, a heat dissipation module was manufactured. Module temperatures were measured and compared with simulation results at input powers of 120 and 180 W. Illuminance tests were also conducted to verify the performance of the LED lamp. The multiple-layer substrates were shown to instantly and effectively dissipate heat outward and prevent degradation in the illumination quality of the LED lamp.<\/p>\n\n\n\n

Keywords: Heat Pipe; Heat Sink; LED; Multiple-Layer Substrates; Nature Convection<\/em><\/p>\n\n\n\n

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  1. [1] Vaccaro, P. O., “Lateral P-N Junctions for High-Density LED Arrays,” Microelectronics Journal, Vol. 34, pp. 355-357 (2003).<\/li>\n
  2. [2] Information on http:\/\/www.lumileds.com\/.<\/li>\n
  3. [3] Kim, L. J., Choi, H., Jang, S. H. and Shin, M. W., “Thermal Analysis of LED Array System with Heat Pipe,” Thermochimica Acta, Vol. 455, pp. 21-25 (2007).<\/li>\n
  4. [4] Lai, C. M., Chiang, C. M. and Ho, C. J., “Thermal Performance of an Indoor Oblong LED Lighting Prototype Incorporating Heat Pipes,” Journal of Asian Architecture and Building Engineering, Vol. 8, pp. 585-592 (2009).<\/li>\n
  5. [5] EIA\/JEDEC Standard No. 51-1, December (1995).<\/li>\n<\/ol>\n<\/div>\n\n\n\n

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